Title of Product/ Design / Equipment:
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Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer
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| Value Proposition:
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Using this technology, the plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions.
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Summary Application:
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Used for bearings.
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Advantages:
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* Good mechanical properties
* Eliminating hazardous Pb in the alloy composition (Lead free process)
* Good cathodic current efficiency
* Good plating rate
* Simplest process.
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Commercialization Status:
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Already Commercialised
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Tech. Readiness Level:
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